NNUMEM NuRAM/SmartMem technology achieves faster speeds and lower dynamic power consumption compared to other MRAM solutions.

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

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The ultra-low-power NuRAM/SmartMem compute-in-memory technology implements MRAM to overcome memory bottlenecks.

At the Summit, Numem will preview its innovative chiplets – nonvolatile, high-speed, ultra-low power solutions that leverage MRAM to overcome memory challenges in chiplet architectures. Sampling is ...

In a report released today, Brian Chin from Stifel Nicolaus maintained a Hold rating on Formfactor (FORM – Research Report), with a price ...

Xallent Inc., a global leader in fine pitch probing and MPI Corporation, a global leader in advanced semiconductor tests, today announced their strategic partnership and launch of the Heterogeneous ...

Custom chips optimized for specific use cases are already demonstrating how we can continue to increase performance while cutting power.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.