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Micron invests $7 billion in HBM assembly facility amid AI boom
Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects ...
Digi Times3h
Samsung's 2024 HBM shipments likely to miss targets amid ongoing challenges
As Samsung Electronics gears up to release its fourth-quarter 2024 financial results, industry observers are closely monitoring the company's progress in meeting its high bandwidth memory (HBM) ...
DMR News (English) on MSN6mon
Huawei and Wuhan Xinxin team up on high-bandwidth memory chips despite US restrictions.
This technology enables the stacking of different types of semiconductors, such as graphics processing units (GPUs) and HBM ...
The Next Platform8d
Taking a closer look at Rambus’ HBM GEN2 PHY
Rambus recently announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the ...
Business Times16d
Micron invests US$7 billion in Woodlands advanced packaging site; 1,400 jobs to be created
MICRON Technology on Wednesday (Jan 8) broke ground in Woodlands for an advanced packaging facility for its high-bandwidth memory (HBM) semiconductor chip. Read more at The Business Times.
Onto Innovation Advances Process Control Suite for 3D Interconnect Yields
Onto Innovation Inc. (NYSE: ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di™ technology on the Dragonfly® G3 system for bump process ...