SanDisk, Kioxia, SK hynix, Micron, Samsung and Macronix were showing their storage and memory solutions at the 2025 CES.

Singapore - Semiconductor equipment maker Grand Venture Technology (GVT) is trying to turn the world’s hunger for advanced ...

Custom chips optimized for specific use cases are already demonstrating how we can continue to increase performance while cutting power.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

It will present products like HBM, eSSD, and innovations in data processing ... along with modularized versions, CMM (CXL Memory Module)-Ax and AiMX, designed to be core infrastructures for ...

3 Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module ... and SK Hynix will produce 6 th generation HBM (HBM4) in the second half of this year to lead the customized ...

Also on display will be a memory module based on Compute Express Link ... including flagship AI memory products such as HBM and eSSD, as well as solutions optimized for on-device AI,” Kim ...

SK hynix, which is the world's first to produce 12-layer HBM products ... and PIM (Processing in Memory) technologies, along with modularized versions, CMM(CXL Memory Module)-Ax and AiMX5 ...

3 Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution ... and SK hynix will produce 6 th generation HBM (HBM4) in the second half of this year to lead the ...