The ultra-low-power NuRAM/SmartMem compute-in-memory technology implements MRAM to overcome memory bottlenecks.

At the Summit, Numem will preview its innovative chiplets – nonvolatile, high-speed, ultra-low power solutions that leverage MRAM to overcome memory challenges in chiplet architectures. Sampling is ...

Partnering with industry giants such as Arm and Keysight, Alphawave Semi will highlight its leadership in UCIe, HBM, and next ...

We take a look at the performance, camera quality, battery life, charging speed, design, and more of the OPPO Find X8 Pro, a ...

Custom chips optimized for specific use cases are already demonstrating how we can continue to increase performance while cutting power.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Two new standards have emerged to specifically address AI scaling needs: ...

Advanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of 19% from 2024 through 2028, according to TechInsights. Interconnect bump heights in high volume manufacturing ...

Marvell Technology has announced the advancement of its custom XPU architecture with co-packaged optics (CPO) technology.

The Xiaomi Pad 7 is offered with accessories such as cover, focus pen, and focus keyboard. These accessories are sold ...

Chiplet Market Research Report By Semiconductor Technology, Device Type, Application, End Market, Region ...