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csdn
23d
晟联科UCIe+SerDes方案塑造高性能计算(HPC)新未来
为实时数据处理、大参数模型训练等场景提供了坚实的技术支撑。 3、Improve Time-to-Market 加快市场速度 HPC芯片作为大算力芯片,Die面积越做越大,采用Multi-Die有利于提升良率,不同Die也可以灵活 ...
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