At its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence today announced a major expansion of its Cadence® Millenniumtm Enterprise Platform with the introduction of the new ...

A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at ...

Detailed price information for Acm Research Inc (ACMR-Q) from The Globe and Mail including charting and trades.

ACM Research, Inc. ("ACM") (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today ...

Powerchip Semiconductor Manufacturing Corporation (PSMC) revealed its collaboration with ten supply chain partners, including ...

May 7, 2025 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the latest advancement in its groundbreaking 3D ...

Apple has announced an interesting 3D AI model called Matrix3D that is able to reconstruct 3D objects and scenes from just a few 2D photos.

Questa One pushes the IC verification boundaries with AI capabilities and faster functional, fault, and formal engines.

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

Adidas’ 3D-printed shoes feel most at home worn casually around the city. It’s here, among other appreciative sneakerheads, ...

NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM ...