InductEV and Skien Norway's ENRX have signed an MOU that seeks to establish technical standards and ensure compatibility ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Two new articles document progress in neuroprosthetic technology that lets people feel the shape and movement of objects moving over the 'skin' of a bionic hand.

Imagine a future where your phone, computer or even a tiny wearable device can think and learn like the human brain -- processing information faster, smarter and using less energy. A breakthrough ...