One of the key areas of focus has been the use of laser-induced thermal crack propagation (LITP) in cutting silicon-glass double-layer wafers. Research demonstrated that high-speed laser cutting ...

4H-SiC: A specific polytype of silicon carbide known for its excellent thermal and electrical properties. Femtosecond Laser Micromachining: A precise laser cutting technique that uses extremely ...

🔹 Laser Dicing Saws ... saws are also used in the production of solar cells, particularly for cutting silicon wafers into smaller, more efficient cells. Other Applications: This includes ...

ASML’s EUV lithography technology is indispensable to the production of cutting-edge microchips, making it a linchpin of the ...

Four of our panelists discuss their favorite investments in the final installment of our 2025 stock-picking confab.

Beijing’s mastery of AI-powered robotics, machine learning, and deep learning technologies have been demonstrated through several successful missions.

This was a ‘core’ invention, which enabled the development of cutting-edge commercial technologies ... the Indian plant manufacturing the silicon wafers lost its business case because of ...

Manchester City has today announced a new multi-year partnership with Veritran, a leading global technology company dedicated to transforming the digital experiences of millions of people around the ...

Laser cutting square panel. Openwork floral pattern with tropical ... Intricate Chip Schemes Blank Silicon Wafer Icon Silicon components and intricate chip schemes. Blank silicon wafer, abstract ...