Chinese memory company Tongu announces HBM2 trial production: should find its way into Huawei AI chips, as HBM3E rules and ...

Tongfu Microelectronics joins CXMT and Wuhan Xinxin in HBM production for Chinese developers of AI processors.

The company’s Q4 revenue increased by 12%, and its operating profit rose by 15%, making for its best quarter ever, SK Hynix ...

Sales of AI memory solutions, including HBM3 and eSSDs, drove SK hynix's revenues and profits to record levels.

Custom chips optimized for specific use cases are already demonstrating how we can continue to increase performance while cutting power.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Musk did not respond to a request for comment from the Financial Times.

Singapore - Semiconductor equipment maker Grand Venture Technology (GVT) is trying to turn the world’s hunger for advanced ...

Micron is teaming up with Pure Storage for the 150TB DirectFlash module Micron's G8 QLC NAND has been qualified ... The ...

Micron’s stock lost a quarter of its value in the last six months. The company’s unamusing outlook for Q2 signals that the ...

Shin Young Securities forecasted that SK hynix's technological advantage will continue. They raised the target stock price ...

Marvell Technology has announced the advancement of its custom XPU architecture with co-packaged optics (CPO) technology.