Samsung Electronics is ramping up development of its next-generation SOCAMM memory, which it sees as a potential rival to ...

Micron this month announced a renewed U.S. buildout strategy that expands investment plans to $150 million, plans to build an ...

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Rising demand for AI servers is forcing memory makers to shift their production priorities, sending shockwaves through the ...

A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure ...

Micron’s product pipeline, especially in high-bandwidth memory and AI-optimized storage, positions the company for continued ...

Online retailers sell some DDR4 memory modules for desktop PCs, notebooks, and servers at far higher prices. Some producers ...

In the meantime, JEDEC expanded the maximum memory module thickness from 720 to 775mm for the HBM3E standard, which still allows for 40µm-thick chiplets. HBM standards specify a per-pin transfer rate, ...

It remains to be seen if the memory business can defy this cycle a bit because of the demand exceeding the supply for HBM memory, but overall, NAND flash seems to be riding down its pulse as normal.