Custom chips optimized for specific use cases are already demonstrating how we can continue to increase performance while cutting power.

Partnering with industry giants such as Arm and Keysight, Alphawave Semi will highlight its leadership in UCIe, HBM, and next ...

According to Frank Ferro, a senior director of product management at Rambus, HBM is a high-performance memory that features reduced power consumption and a small form factor. More specifically, it ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Advanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of 19% from 2024 through 2028, according to TechInsights. Interconnect bump heights in high volume manufacturing ...

Truechip’s ... Truechip's HDMI Verification IP provides an effective & efficient way to verify the components interfacing with HDMI interface of an ASIC/FPGA or SoC. Truechip's HDMI VIP is fully ...

With the recent boom in artificial intelligence, South Korean chip giant SK hynix Inc. has emerged as one of the most influential players in the global semiconductor industry, especially in the high ...

The benefits of custom HBM include increased memory capacity, a reduction in power consumption and space savings for more compute logic. The new architecture is comprised of advanced die-to-die ...

The Evolution of HBM reviews the memory solution’s journey from 2.5D to ... how to build in cache coherency, and the different interfaces in a complex system. For more Semiconductor Engineering videos ...

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the advancement of its custom XPU architecture with co-packaged optics (CPO) ...

Chiplet Market Research Report By Semiconductor Technology, Device Type, Application, End Market, Region ...

HBM and other chiplets with Marvell 3D SiPho Engines on the same substrate using high-speed SerDes, die-to-die interfaces and advanced packaging technologies. This approach eliminates the need for ...