At its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence today announced a major expansion of its Cadence® Millenniumtm Enterprise Platform with the introduction of the new ...

A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at ...

FREMONT, Calif., May 08, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. ("ACM”) (NASDAQ: ACMR), a leading supplier of wafer ...

ACM Research, Inc. ("ACM") (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today ...

Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of ...

How are 3D printing and metal injection molding changing golf club design? Learn the pros, cons and future of these ...

Lenovo today has announced the launch of the new Legion 9i gaming laptop, a laptop that's designed not just for the people who love playing games, but ...

Lenovo is announcing a new 10th-generation Legion 9i gaming laptop coming soon to China and scheduled for the fall in North ...

NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM ...

Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just scaling digital logic. It requires new materials, and ...

Imagine creating 3D-sensing technologies so lightweight, compact and high-performance that they could take us to planets ...

Forge Nano, Inc., a technology company pioneering domestic battery and semiconductor innovations, today announced the successful close of $40 million in new funding.