Today we're exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser World's oldest woman who credited long life to two simple things dies aged ...

International research team unveils the first electrically pumped continuous-wave semiconductor laser designed for seamless ...

One of the key areas of focus has been the use of laser-induced thermal crack propagation (LITP) in cutting silicon-glass double-layer wafers. Research demonstrated that high-speed laser cutting ...

The video below shows his two-step process, which first blasts the silicon oxide layer off the wafer before doping with the laser shining through a bath of phosphoric acid. The process is ...

It sat inside of a big box whose job was to take silicon wafers in on one side and spit out integrated circuits on the other. [BrendaEM] never really divulges how she got her hands on something so ...

imec, a Belgium-based research and innovation hub in nanoelectronics and digital technologies, has announced “a significant milestone in silicon photonics” with the successful demonstration of ...

Wafers supplied by Longi were laser-cut from the center of pseudo-square M10-sized n-type RCz silicon wafers. There were three specimen groups, one that remained untreated, a second group that ...

🔹 Laser Dicing Saws ... saws are also used in the production of solar cells, particularly for cutting silicon wafers into smaller, more efficient cells. Other Applications: This includes ...