Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects ...
This technology enables the stacking of different types of semiconductors, such as graphics processing units (GPUs) and HBM ...
Rambus recently announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the ...
MICRON Technology on Wednesday (Jan 8) broke ground in Woodlands for an advanced packaging facility for its high-bandwidth memory (HBM) semiconductor chip. Read more at The Business Times.
Advanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of 19% from 2024 through 2028, according to TechInsights. Interconnect bump heights in high volume manufacturing ...